Tag Archives: TDK

TDK Announces World’s First MIPI Standard Sound Microphone at CES 2020

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TDK Corporation announced the world’s first MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can seamlessly transition back and forth without audio glitches.

The SoundWire Standards Committee, who created the MIPI standard for SoundWire, includes technology leaders in application processors, audio DSPs and codecs, and other ICs. SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire revolutionizes how audio devices and ICs communicate by integrating audio and control data for up to 11 devices (e.g. 7 mics, 4 speakers) on a single bus.

“As a member of the SoundWire Standards Committee, Qualcomm Technologies has supported the SoundWire Interface on speaker amplifier products for a number of years. We are excited to see TDK’s microphone technology now incorporating this interface.” said Rahul Shinke, Director, Product Management at Qualcomm Technologies, Inc.

T5808 is currently in mass production and will be available through distribution in Q1 2020.

TDK will be demonstrating the T5808 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), CES 2020.

TDK Looking to Double Hard Drive Capacity

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Storage, both HDD and SSD, is growing in capacity and shrinking in price all of the time.  With hard drives currently as large as 2 TB available, and promises of even bigger ones coming it seems there is almost more storage already than anyone of needs.  Plus, for those willing to pay a premium, there are SSD’s, which are smaller in capacity, but much faster in read time.  Plus, we have even heard vague rumors of holographic storage coming in the future.

Now, from the future technologies department comes some news that TDK, the once famous cassette tape maker, has a technology that could double the storage capacity of a hard drive by using laser heaters to write the data.  TDK calls the technology HAMR – heat-assisted magnetic recording.  The laser needs to be combined with a new way of making the drive platters.  Supposedly TDK has used the technology with platters that would normally have held 1 TB of data and successfully stored 2 TB on them.

It sounds very futuristic, and honestly it is.  There is no release date for the technology, no idea of how such drives would be priced in comparison to a standard drive, and no real idea if this technology will ever even hit the market.  Frankly, beyond this one report from the Register, there is really no concrete evidence of this technology existing.  But the science of storage is always moving ahead at a fast pace, so it’s likely that such things as this are at least being tested.